Xilinx公司的7系列FPGA包括Artix™-7, Kintex™-7 和Virtex®-7 三个系列,具有超高端连接带宽,逻辑容量和信号完整性,提供低成本,小型尺寸和大容量的要求最严格的高性能应用.其中的Kintex-7 FPGA具有最高的性价比,其所组成的收发器从600 Mbps到最高的6.6 Gbps ,高达到28.05 Gbps,主要用在航空电子,LED背光的平板电视和3D TV,LTE基带,手持超声设备,多模式无线电,Prosumer数码单反照相机和视频IP网关.本文介绍了7系列FPGA主要特性, Kintex-7 FPGA系列主要特性和应用优势,以及评估板KC705主要特性,方框图, 评估板KC705主要元件, 配置电路图,详细电路图和材料清单.

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series devices are the programmable silicon foundation for Targeted Design Platforms that enable designers to focus on innovation from the outset of their development cycle. The 7 series FPGAs include:

• Artix™-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.

• Kintex™-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

• Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs. All 7 series devices share a unified fourthgeneration Advanced Silicon Modular Block (ASMBL™) column-based architecture that reduces system development and deployment time with simplified design portability.

7系列FPGA主要特性:

• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

• High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.

• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

• Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

7系列FPGA特性比较表:

Kintex-7 FPGA系列主要特性:

Kintex-7 FPGA系列主要应用和特点:

1. Kintex-7 FPGA系列在LTE通信应用

Kintex-7 FPGAs offer the best price-performance so designers can meet stringent latency requirements for LTE baseband processing in a common platform.

• Programmability enables a cost-effective common platform supporting multiple air interfaces such as LTE, WiMAX, and WCDMA

• Reduce total cost of ownership with the ability to scale and reuse designs from picocell to macrocell

• 3x capacity at the same cost of previous-generation FPGAs while consuming 40% less power

• Support for 9.8Gbps CPRI/OBSAI for high throughput

• Support for 6.144Gbps CPRI/OBSAI in a low-cost package option

图1. Kintex-7 FPGA单片LTE通信基带框图(2x4MIMO)

2. Kintex-7 FPGA系列在医疗电子应用

Support for 6.144Gbps CPRI/OBSAI in a low-cost package optionHigh I/O bandwidth and 144GMACS DSP processing power in chip-scale packaging make the Kintex-7 70T FPGA highly effective for both front- and back-end ultrasound processing. Designers can deploy a fully programmable 128-channel ultrasound implementation that scales up to 196 or 256 channels for high-end cart solutions or down to 64 or 32 channels for hand-held solutions.

• 128-channel implementation in a modular set of five Kintex-7 70T FPGAs offers 44% lower power, 45% lower cost, and 57% smaller form factor compared to previous-generation FPGAs

• Kintex-7 70T FPGAs offer 144GMACS from 240 DSP slices (288GMACS for symmetric filters)

• Built-in support for eight PCI Express Gen1/Gen2 channels enables high-bandwidth interface to host system

• Chip-scale packaging for small form factor

图2. Kintex-7 FPGA系列在手持超声设备的应用框图

3. Kintex-7 FPGA系列在广播设备的应用

Kintex-7 FPGAs enable cost-effective, low-power bridging of the serial digital interface (SDI) protocol onto IP technology for long-distance WAN transport to link local studios/live events, broadcast facilities, and satellite uplink stations using standard IP networks.

• Reduce power by 64% and reduce cost by 85% with a single XC7K160T FPGA implementation of a 12x 3G-SDI over 4x10GbE bridge compared to the equivalent function implemented in two Virtex-6 XC6L130T devices

• Reduce cost further with high-bandwidth interfaces that shrink BOM: 72-bit x 1,600Mbps DDR3 memory interface capability enables a single memory buffer that would require two or four memory buffers in previous-generation FPGAs

图3. Kintex-7 FPGA系列在视频IP网关的应用框图

Kintex-7 FPGA系列评估板KC705

The KC705 evaluation board for the Kintex™-7 FPGA provides a hardware environment for developing and evaluating designs targeting the Kintex-7 XC7K325T-2FFG900C FPGA. The KC705 board provides features common to many embedded processing systems, including a DDR3 SODIMM memory, an 8-lane PCI Express® interface, a tri-mode Ethernet PHY, general purpose I/O, and a UART interface. Other features can be added by using mezzanine cards attached to either of two VITA-57 FPGA mezzanine connectors (FMC) provided on the board. High pin count (HPC) and low pin count (LPC) FMCs are provided.

评估板KC705主要特性:

• Kintex-7 XC7K325T-2FFG900C FPGA

• 1 GB DDR3 memory SODIMM

• 128 MB Linear BPI Flash memory

• 128 Mb Quad-SPI Flash memory

• Secure Digital (SD) connector

• USB JTAG via Digilent module

• Clock Generation

• Fixed 200 MHz LVDS oscillator (differential)

• I2C programmable LVDS oscillator (differential)

• SMA connectors (differential)

• SMA connectors for GTX transceiver clocking

• GTX transceivers

• FMC HPC connector (four GTX transceivers)

• FMC LPC connector (one GTX transceiver)

• SMA connectors (one pair each for TX, RX and REFCLK)

• PCI Express (eight lanes)

• Small form-factor pluggable plus (SFP+) connector

• Ethernet PHY SGMII interface (RJ-45 connector)

• PCI Express endpoint connectivity

• Gen1 8-lane (x8)

• Gen2 8-lane (x8)

• SFP+ Connector

• 10/100/1000 tri-speed Ethernet PHY

• USB-to-UART bridge

• HDMI codec

• I2C bus

• I2C MUX

• I2C EEPROM (1 KB)

• USER I2C programmable 3.3V LVDS oscillator

• DDR3 SODIMM socket

• HDMI codec

• FMC HPC connector

• FMC LPC connector

• SFP+ connector

• I2C programmable jitter-attenuating precision clock multiplier

• Status LEDs

• Ethernet status

• Power good

• FPGA INIT

• FPGA DONE

• User I/O

• USER LEDs (eight GPIO)

• User pushbuttons (five directional)

• CPU reset pushbutton

• User DIP switch (4-pole GPIO)

• User SMA GPIO connectors (one pair)

• LCD character display (16 characters x 2 lines)

• Switches

• Power on/off slide switch

• Configuration mode DIP switch

• VITA 57.1 FMC HPC Connector

• VITA 57.1 FMC LPC Connector

• Power management

• PMBus voltage and current monitoring via TI power controller

• XADC header

• Configuration options

• Linear BPI Flash memory

• Quad SPI

• USB JTAG configuration port

• Platform cable header JTAG configuration port

图4.评估板KC705方框图

图5.评估板KC705外形图

评估板KC705主要元件:


图6.评估板KC705配置电路图

KC705评估板详细电路图见:
https://secure.xilinx.com/webreg/clickthrough.do?cid=181332&license=RefDesLicense&filename=kc705_Schematic_xtp132_rev1_0.pdf
KC705评估板材料清单见:
https://secure.xilinx.com/webreg/clickthrough.do?cid=181320&license=RefDesLicense&filename=kc705_BOM_rdf0149_rev1_0.zip
详情请见:
http://www.xilinx.com/support/documentation/data_sheets/ds180_7Series_Overview.pdf
和http://www.xilinx.com/support/documentation/boards_and_kits/ug810_KC705_Eval_Bd.pdf