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德州仪器进一步提高模拟产能

购买设备启动第二阶段 RFAB 扩产产量提高驱动未来增长
2010-05-04
作者:德州仪器
关键词: 工艺技术 晶圆 TI RFAB

  德州仪器 (TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" 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title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI" title="TI">TI) 宣布,近期从奇梦达(Qimonda) 北美公司与奇梦达(Qimonda)德国德累斯顿公司成功购买100 多套工具,为满足客户需求TI再次扩展模拟制造产能。
 
  这是启动TI总部附近德克萨斯州 Richardson 晶圆制造厂(RFAB)第二阶段扩大产能的第一步,该厂是业界第一个 300 mm模拟晶圆厂。
 
  RFAB 第二阶段完工后,德克萨斯北部制造厂的模拟制造产能将提高一倍,创造营收将达约 20 亿美元。TI 即将开始第二阶段的工厂设备安装,以便根据市场需求投入运营。第一阶段与第二阶段结合后,其所在面积仅占该工厂 110万平方英尺面积的三分之二,可为今后进一步扩展预留更多空间。
 
  TI 负责公司模拟业务高级副总裁 Gregg Lowe 表示:“我们的 300 mm晶圆厂是我们模拟业务发展的重要里程碑。由于第一阶段进展顺利,一切按计划进行,到今年年底将开始出货,因此第二阶段扩展将为我们提供一个抢先起步的优势,可帮助我们的客户实现强大的模拟产能,推动其业务发展。”
 
  该晶圆制造厂将采用 TI 专有工艺生产模拟集成电路。客户可在包括智能电话、上网本、电信以及计算系统的各种电子设备中使用这些芯片。
 
  RFAB 第二阶段是 TI 过去两年模拟制造扩展系列中的最近一项:

   •2009 年第 四季度,TI 开始在达拉斯工厂、德国弗莱辛工厂以及日本有限公司美蒲工厂安装近 200 套制造工具,用于 200 mm晶圆制造;
   •2009 年第三季度,TI 宣布 RFAB 第一阶段启动,并立即开始设备安装,这是业界第一个 300 mm模拟晶圆制造厂;
   •2009 年第二季度至 2010 年第二季度,TI 新安装 400 多台测试仪;
   •2009 年初,TI 在菲律宾启动占地面积 80 万平方英尺的Clark封测厂,该厂拥有最先进的封装技术,并迅速投产;
   •2008 年,TI 从达拉斯一家未完全投入使用的晶圆厂重新调出 150 多套工具,以增强全球其它模拟工厂的产能。
 
  如欲了解 TI 输出产能与模拟制造投资的更多详情,敬请访问:www.ti.com/capacity-pr。如欲了解有关 RFAB 的更多详情,敬请点击http://newscenter.ti.com/media/p/2970.aspx
 
商标
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关于德州仪器公司
  德州仪器 (TI) 始终致力于帮助客户从容应对任何设计挑战,从而开发出创新的电子解决方案,让未来世界更智能、更健康、更安全、更环保以及更精彩。作为全球性的半导体公司,TI 在全球超过 30 个国家设有制造、设计或销售机构。
 
  TI 在纽约证交所上市交易,交易代码为 TXN。
 
  如欲了解有关 TI 的进一步信息,敬请查询 http://www.ti.com.cn
 
  TI 半导体产品信息中心免费热线电话:800-820-8682。
 
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