(No.58 Research Institute of China Electronics Technology Group Corporation， Wuxi 214035，China)
Abstract： With the advent of the post-Moore era, it has become a new direction for the development of the integrated circuit industry to meet the miniaturization and integration of the system through system-level packaging technology. In view of the large demand for low power consumption, miniaturization and integration of controllers in the current market, this paper proposes a system-level packaging technology. Based on a series of design methods such as principle design, package structure design, layout design, signal integrity simulation, power integrity simulation, and thermal stress simulation, combined with the current domestic manufacturing process level, a fully localized controller integrated chip was developed. The integrated chip takes FPGA as the control core, integrates the RF local oscillator signal source and DDS signal source, and realizes the functions of control, output and communication of the RF signal source. Finally, through the test and verification of the sample, the chip has stable function and reliable index, which meets the requirements of technical indicators. Compared with the controller board, the designed integrated chip greatly reduces the power consumption of the product, realizes the miniaturization and integration of the controller, meets the current market application requirements, and provides technical and feasibility reference for the subsequent research of controller integrated chips.
Key words : system in package；controller；integrated chip；RF signal source
【引言】
目前，集成电路芯片制造工艺的特征尺寸已到达5 nm，制造工艺的特征尺寸开始向3 nm甚至1 nm迈进，遵循摩尔定律的晶体管特征尺寸等比例缩小的发展趋势已开始放缓，成本却在大幅提高，而且集成电路技术的工艺节点也逐步接近其物理极限，集成电路行业已进入后摩尔时代[1]。在后摩尔时代，通过系统级封装技术（System in Package，SiP）来实现片上系统的小型化、多功能化和集成化已成为集成电路行业发展的新方向。
