半导体设备用简易高操作性连接固定装置设计
集成电路应用
吴萍森
上海芯上微装科技股份有限公司
摘要： 针对半导体设备腔体狭小、极端工况下结构件拆装难、固定可靠性不足的问题，该文设计一种基于弹簧松不脱螺钉与轻量化转接块的连接固定装置。装置采用TA13材质制备，具备小型化、轻量化特性，可适配高低温、水下等严苛环境；通过按压式锁紧结构，无需专用工具即可实现托盘类组件快速拆装，有效解决传统螺钉连接操作繁琐、空间适配性差的痛点。试验与应用表明，该装置结构紧凑、操作便捷，可显著提升半导体设备装配与运维效率，适用于机箱、机柜及水下半导体设备等场景。
中图分类号：TN305.94文献标识码：ADOI:10.19339/j.issn.1674-2583.2026.05.006
中文引用格式：吴萍森. 半导体设备用简易高操作性连接固定装置设计［J］.集成电路应用，2026，43（5）：40-43.
英文引用格式：Wu Pingsen. Design of simple and highly operable connection fixtures for semiconductor equipment［J］.Application of IC，2026，43（5）：40-43.
中文引用格式：吴萍森. 半导体设备用简易高操作性连接固定装置设计［J］.集成电路应用，2026，43（5）：40-43.
英文引用格式：Wu Pingsen. Design of simple and highly operable connection fixtures for semiconductor equipment［J］.Application of IC，2026，43（5）：40-43.
Design of simple and highly operable connection fixtures for semiconductor equipment
Wu Pingsen
Shanghai Xinshang Micro-pack Technology Co., Ltd.
Abstract： Aiming at the narrow cavity leading to difficulty in disassembling and assembling structural parts under extreme operating conditions and insufficient fixing reliability of semiconductor equipment, a connecting and fixing device based on spring-loaded captive screws and lightweight adapter blocks is designed. The device is made of TA13 material, which has the characteristics of miniaturization and light weight, and can adapt to harsh environments with a wide range of temperature and submerged conditions; through the press-type locking structure, the tray components can be quickly disassembled without special tools, which effectively solves the pain points of traditional screw connection such as cumbersome operation and poor space adaptability. Tests and applications show that the device has a compact structure and convenient operation, which can significantly improve the assembly, operation and maintenance efficiency of semiconductor equipment, and is suitable for scenarios such as chassis, cabinets and underwater semiconductor equipment.
Key words : semiconductor equipment; spring-loaded captive screw; quick connection; narrow space; TA13 material
引言
半导体设备内部腔体空间日趋紧凑，由于部分工艺设备需在高低温、水下等极端环境下运行,设备正朝着小型化、集成化、高可靠性方向发展。狭小空间内结构件的连接与固定是设备设计与运维的关键环节，传统普通螺钉搭配连接块的固定方式，拆装依赖螺丝刀等专用工具，操作空间受限导致作业难度大、效率低，且难以兼顾连接便捷性与固定稳定性，无法适配半导体设备严苛的工况需求。
为此，本文提出一种结构小巧、操作简便的连接固定装置，其采用弹簧松不脱螺钉与TA13材质转接块组合结构，实现装置小型化、轻量化；通过柔性按压锁紧机制，无需专用工具即可完成组件快速拆装，以解决狭小空间及极端环境下结构件连接固定难题，为半导体设备精密组件装配提供高效解决方案。
本文详细内容请下载：
http://www.chinaaet.com/resource/share/2000007272
投稿邮箱：ICAPP@belling.com.cn
作者信息：
吴萍森
(上海芯上微装科技股份有限公司，上海201209)
此内容为AET网站原创，未经授权禁止转载。